As the core component of robot driving applications, the development of power semiconductor devices has always been a focus of industry attention. As a pioneer in modern power semiconductor devices, Mitsubishi Electric has always taken it as its responsibility to provide high-precision and reliable products to the market, striving to meet and lead new market demands with cutting-edge technology.

It is reported that in the future, robot servo drive technology will develop towards two major trends – multi axis servo drive solutions and high power density design. This also means that the market will require power modules with more features, lower losses, more compact appearance, and higher integration level.

Therefore, Mitsubishi Electric has launched three power module solutions for different power ranges of servo drives: CIB-IGBT solution, IPM solution, and DIPIPM solution ™/ DIPIPM+ ™ Plan.
The 7th generation IGBT CIB solution launched by Mitsubishi Electric has the characteristics of integrated packaging (SLC), ultra-low stray inductance, and excellent thermal cycling life. It uses a single substrate to reduce binding lines; The thickness of the copper sheet has increased, optimizing the wiring width; Using DP resin to reduce mechanical stress between binding wires and silicon wafers; Removed the welding layer and removed the weak points of thermal cycling.

At present, Mitsubishi Electric Semiconductor has launched an IPM module based on the 7th generation IGBT chip technology, which integrates a driver IC inside the module to adjust the driving current to change the dv/dt under different currents, making it easy to design system EMI; Collaborate with optimized driver ICs to identify fault types and facilitate system design and debugging; Adopting SLC packaging technology and optimizing the packaging materials of modules to improve module lifespan and reliability.

“The 7th generation IPM has low loss, low EMI noise, identifiable fault signals, and long thermal cycle life, making it particularly suitable for servo drive of high-end multi axis robots,” Director Song summarized.

Among them, the G1 series is compatible with the G series IPM packaging size, with built-in 7th generation IGBT/FWD chips with lower losses, and adopts a new packaging technology for better reliability; In addition, the new driver circuit further reduces losses and EMI noise. The control terminals of the G1 series are compatible with the G/L1 series and can use the same interface circuit. The main functions are the driver circuit and protection circuit.

In terms of packaging technology, the G1 series of the 7th generation IPM has a thinner and more compact packaging, with a volume reduction of 18-31%; A-type packaging is more suitable for flexible layout applications, such as the G1 series which offers two types of terminals to choose from.

In order to meet the application needs of the frequency conversion market (high reliability, low cost, miniaturization, etc.), Mitsubishi has developed a series of DIPIPMTM products. It is a dual inline packaging IPM with built-in HVIC, making its peripheral circuits simpler and cost saving. It is now widely used in products including household appliances, small frequency converters, industrial servos, etc.

It can be said that Mitsubishi Electric Semiconductor is a pioneer in die casting die packaging of IPM products. For different applications, Mitsubishi Electric continuously optimizes power silicon wafers, has the widest product line, and has accumulated rich experience in IPM. Its products maintain high cost-effectiveness while ensuring high reliability and low failure rate.

Since 1921, Mitsubishi Electric has been continuously launching generation after generation of products with better performance and higher cost-effectiveness, focusing on five major application areas: variable frequency household appliances, industry, new energy, rail traction, and electric vehicles, with product research and technological innovation as the original intention. Now, Mitsubishi Electric’s DIPIPM is being developed and launched ™️ It has become an indispensable and important component of the field of variable frequency household appliances, and its HVIGBT module for high-speed locomotives has also become an industry recognized standard.

As a pioneer in modern power semiconductor devices, Mitsubishi Electric is driven by a spirit of continuous innovation, empowering through technology and speaking with products. Under the goal of improving production efficiency, providing high-quality products, and meeting environmental development needs, Mitsubishi Electric will continue to match the development needs of China’s industrial automation transformation and upgrading with finely crafted products.